This is a quick photo to illustrate the three different package sizes I have for the PIC12f683 that I’m using in my Lego beacon. The rightmost (PDIP) is your standard, everyday, through-the-hole chip. The middle one is the surface mount 150 mil SOIC that is fairly easy to work with if you are careful. The right most two are the top and bottom of the tiny DFN lead-less package that I think I might have a go at using in my next prototype.
PIC 12f683 in three package sizes (DFN, SOIC, PDIP)
From left to right.
Chip 1 & 2.
DFN : 8-Lead Plastic Dual Flat, No Lead Package. 0.8 mm pad pitch.
4 x 4 x 0.9 mm body.
(first image shows underside of package).
SOIC : 8-Lead Plastic Small Outline. 1.27mm pin pitch.
3.90 x 4.9 x 1.75 mm body. (not including pins)
PDIP : 8-Lead Plastic Dual In-Line. 2.54mm pin pitch.
Approx. 7 x 10 x 4 mm body (not including pins)
Info taken from the microchip datasheet.